|
序
号
NO |
特征
Technical
ltem |
印制版标准PCB Standard |
要求
Requirement |
|
GB/T4588
2-1996 |
GB/T4588
4-1996 |
IEC
62326-3 |
IEC
62326-4 |
IEC
6012A |
|
1 |
表面和孔镀层厚度
Surface and hole plating thickness |
√ |
√ |
√ |
√ |
√ |
平均25um最小18um
Avgerage25um
Min.18um |
|
2 |
电路绝缘性
Insulation resistance |
√ |
√ |
√ |
√ |
√ |
电阻>1.0×1010Ω
Resist>1.0×1010Ω |
|
3 |
阻焊膜硬度
Solder resist hardness |
√ |
√ |
√ |
√ |
√ |
>3H |
|
4 |
阻焊剂固化和附着力
Solder resist cure and adhesion |
√ |
√ |
√ |
√ |
√ |
不呈现粘性，无拉脱落
No stick, no peel
off |
|
5 |
镀镍金厚度
Nickel and gold thickness |
√ |
√ |
√ |
√ |
√ |
视合同约定
By
contract |
|
6 |
弓曲和扭曲
Bow&twist |
√ |
√ |
√ |
√ |
√ |
表面安装印制板最大为0.75%，其余1.5%
SMT PCB less than
0.75%,other1.5% |
|
7 |
可焊性
Solderability |
√ |
√ |
√ |
√ |
√ |
3S可焊
3S
solderability |
|
8 |
插头部位厚度
Contact thickness |
√ |
√ |
√ |
√ |
√ |
+/-0.15mm |
|
9 |
镀层附着力
Plating adhesion |
√ |
√ |
√ |
√ |
√ |
符合拉脱式测试
Withstand pull
test |
|
10 |
外形尺寸
Dimension |
√ |
√ |
√ |
√ |
√ |
最大-0.3mm
Max.-0.3mm |
|
11 |
导线宽度减小
Line reduction |
√ |
√ |
√ |
√ |
√ |
不超过最小导线宽度的20%
Less than
20% |
